소스 검색

bonding: Improve syslog message at device creation time

When the bonding module is loaded, it creates bond0 by default.
Then, when attempting to create bond0, the following messages
are printed to syslog:

    kernel: bonding: bond0 is being created...
    kernel: bonding: Bond creation failed.

Which seems to indicate a problem, when in reality there is no
problem.  Since the actual error code is passed down from bond_create,
make use of it to print a bit less ominous message:

    kernel: bonding: bond0 is being created...
    kernel: bond0 already exists.

Signed-off-by: Phil Oester <kernel@linuxace.com>
Signed-off-by: Andy Gospodarek <andy@greyhouse.net>
Signed-off-by: David S. Miller <davem@davemloft.net>
Phil Oester 15 년 전
부모
커밋
5f86cad1e8
1개의 변경된 파일4개의 추가작업 그리고 1개의 파일을 삭제
  1. 4 1
      drivers/net/bonding/bond_sysfs.c

+ 4 - 1
drivers/net/bonding/bond_sysfs.c

@@ -118,7 +118,10 @@ static ssize_t bonding_store_bonds(struct class *cls,
 		pr_info("%s is being created...\n", ifname);
 		rv = bond_create(net, ifname);
 		if (rv) {
-			pr_info("Bond creation failed.\n");
+			if (rv == -EEXIST)
+				pr_info("%s already exists.\n", ifname);
+			else
+				pr_info("%s creation failed.\n", ifname);
 			res = rv;
 		}
 	} else if (command[0] == '-') {