Kconfig 15 KB

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  1. #
  2. # Generic thermal sysfs drivers configuration
  3. #
  4. menuconfig THERMAL
  5. tristate "Generic Thermal sysfs driver"
  6. help
  7. Generic Thermal Sysfs driver offers a generic mechanism for
  8. thermal management. Usually it's made up of one or more thermal
  9. zone and cooling device.
  10. Each thermal zone contains its own temperature, trip points,
  11. cooling devices.
  12. All platforms with ACPI thermal support can use this driver.
  13. If you want this support, you should say Y or M here.
  14. if THERMAL
  15. config THERMAL_HWMON
  16. bool
  17. prompt "Expose thermal sensors as hwmon device"
  18. depends on HWMON=y || HWMON=THERMAL
  19. default y
  20. help
  21. In case a sensor is registered with the thermal
  22. framework, this option will also register it
  23. as a hwmon. The sensor will then have the common
  24. hwmon sysfs interface.
  25. Say 'Y' here if you want all thermal sensors to
  26. have hwmon sysfs interface too.
  27. config THERMAL_OF
  28. bool
  29. prompt "APIs to parse thermal data out of device tree"
  30. depends on OF
  31. default y
  32. help
  33. This options provides helpers to add the support to
  34. read and parse thermal data definitions out of the
  35. device tree blob.
  36. Say 'Y' here if you need to build thermal infrastructure
  37. based on device tree.
  38. config THERMAL_WRITABLE_TRIPS
  39. bool "Enable writable trip points"
  40. help
  41. This option allows the system integrator to choose whether
  42. trip temperatures can be changed from userspace. The
  43. writable trips need to be specified when setting up the
  44. thermal zone but the choice here takes precedence.
  45. Say 'Y' here if you would like to allow userspace tools to
  46. change trip temperatures.
  47. choice
  48. prompt "Default Thermal governor"
  49. default THERMAL_DEFAULT_GOV_STEP_WISE
  50. help
  51. This option sets which thermal governor shall be loaded at
  52. startup. If in doubt, select 'step_wise'.
  53. config THERMAL_DEFAULT_GOV_STEP_WISE
  54. bool "step_wise"
  55. select THERMAL_GOV_STEP_WISE
  56. help
  57. Use the step_wise governor as default. This throttles the
  58. devices one step at a time.
  59. config THERMAL_DEFAULT_GOV_FAIR_SHARE
  60. bool "fair_share"
  61. select THERMAL_GOV_FAIR_SHARE
  62. help
  63. Use the fair_share governor as default. This throttles the
  64. devices based on their 'contribution' to a zone. The
  65. contribution should be provided through platform data.
  66. config THERMAL_DEFAULT_GOV_USER_SPACE
  67. bool "user_space"
  68. select THERMAL_GOV_USER_SPACE
  69. help
  70. Select this if you want to let the user space manage the
  71. platform thermals.
  72. config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  73. bool "power_allocator"
  74. select THERMAL_GOV_POWER_ALLOCATOR
  75. help
  76. Select this if you want to control temperature based on
  77. system and device power allocation. This governor can only
  78. operate on cooling devices that implement the power API.
  79. endchoice
  80. config THERMAL_GOV_FAIR_SHARE
  81. bool "Fair-share thermal governor"
  82. help
  83. Enable this to manage platform thermals using fair-share governor.
  84. config THERMAL_GOV_STEP_WISE
  85. bool "Step_wise thermal governor"
  86. help
  87. Enable this to manage platform thermals using a simple linear
  88. governor.
  89. config THERMAL_GOV_BANG_BANG
  90. bool "Bang Bang thermal governor"
  91. default n
  92. help
  93. Enable this to manage platform thermals using bang bang governor.
  94. Say 'Y' here if you want to use two point temperature regulation
  95. used for fans without throttling. Some fan drivers depend on this
  96. governor to be enabled (e.g. acerhdf).
  97. config THERMAL_GOV_USER_SPACE
  98. bool "User_space thermal governor"
  99. help
  100. Enable this to let the user space manage the platform thermals.
  101. config THERMAL_GOV_POWER_ALLOCATOR
  102. bool "Power allocator thermal governor"
  103. help
  104. Enable this to manage platform thermals by dynamically
  105. allocating and limiting power to devices.
  106. config CPU_THERMAL
  107. bool "generic cpu cooling support"
  108. depends on CPU_FREQ
  109. depends on THERMAL_OF
  110. help
  111. This implements the generic cpu cooling mechanism through frequency
  112. reduction. An ACPI version of this already exists
  113. (drivers/acpi/processor_thermal.c).
  114. This will be useful for platforms using the generic thermal interface
  115. and not the ACPI interface.
  116. If you want this support, you should say Y here.
  117. config CLOCK_THERMAL
  118. bool "Generic clock cooling support"
  119. depends on COMMON_CLK
  120. depends on PM_OPP
  121. help
  122. This entry implements the generic clock cooling mechanism through
  123. frequency clipping. Typically used to cool off co-processors. The
  124. device that is configured to use this cooling mechanism will be
  125. controlled to reduce clock frequency whenever temperature is high.
  126. config DEVFREQ_THERMAL
  127. bool "Generic device cooling support"
  128. depends on PM_DEVFREQ
  129. depends on PM_OPP
  130. help
  131. This implements the generic devfreq cooling mechanism through
  132. frequency reduction for devices using devfreq.
  133. This will throttle the device by limiting the maximum allowed DVFS
  134. frequency corresponding to the cooling level.
  135. In order to use the power extensions of the cooling device,
  136. devfreq should use the simple_ondemand governor.
  137. If you want this support, you should say Y here.
  138. config THERMAL_EMULATION
  139. bool "Thermal emulation mode support"
  140. help
  141. Enable this option to make a emul_temp sysfs node in thermal zone
  142. directory to support temperature emulation. With emulation sysfs node,
  143. user can manually input temperature and test the different trip
  144. threshold behaviour for simulation purpose.
  145. WARNING: Be careful while enabling this option on production systems,
  146. because userland can easily disable the thermal policy by simply
  147. flooding this sysfs node with low temperature values.
  148. config HISI_THERMAL
  149. tristate "Hisilicon thermal driver"
  150. depends on ARCH_HISI || COMPILE_TEST
  151. depends on HAS_IOMEM
  152. depends on OF
  153. default y
  154. help
  155. Enable this to plug hisilicon's thermal sensor driver into the Linux
  156. thermal framework. cpufreq is used as the cooling device to throttle
  157. CPUs when the passive trip is crossed.
  158. config IMX_THERMAL
  159. tristate "Temperature sensor driver for Freescale i.MX SoCs"
  160. depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
  161. depends on MFD_SYSCON
  162. depends on OF
  163. help
  164. Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
  165. It supports one critical trip point and one passive trip point. The
  166. cpufreq is used as the cooling device to throttle CPUs when the
  167. passive trip is crossed.
  168. config MAX77620_THERMAL
  169. tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
  170. depends on MFD_MAX77620
  171. depends on OF
  172. help
  173. Support for die junction temperature warning alarm for Maxim
  174. Semiconductor PMIC MAX77620 device. Device generates two alarm
  175. interrupts when PMIC die temperature cross the threshold of
  176. 120 degC and 140 degC.
  177. config QORIQ_THERMAL
  178. tristate "QorIQ Thermal Monitoring Unit"
  179. depends on THERMAL_OF
  180. depends on HAS_IOMEM
  181. help
  182. Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
  183. It supports one critical trip point and one passive trip point. The
  184. cpufreq is used as the cooling device to throttle CPUs when the
  185. passive trip is crossed.
  186. config SPEAR_THERMAL
  187. tristate "SPEAr thermal sensor driver"
  188. depends on PLAT_SPEAR || COMPILE_TEST
  189. depends on HAS_IOMEM
  190. depends on OF
  191. help
  192. Enable this to plug the SPEAr thermal sensor driver into the Linux
  193. thermal framework.
  194. config ROCKCHIP_THERMAL
  195. tristate "Rockchip thermal driver"
  196. depends on ARCH_ROCKCHIP || COMPILE_TEST
  197. depends on RESET_CONTROLLER
  198. depends on HAS_IOMEM
  199. help
  200. Rockchip thermal driver provides support for Temperature sensor
  201. ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
  202. trip point. Cpufreq is used as the cooling device and will throttle
  203. CPUs when the Temperature crosses the passive trip point.
  204. config RCAR_THERMAL
  205. tristate "Renesas R-Car thermal driver"
  206. depends on ARCH_RENESAS || COMPILE_TEST
  207. depends on HAS_IOMEM
  208. help
  209. Enable this to plug the R-Car thermal sensor driver into the Linux
  210. thermal framework.
  211. config RCAR_GEN3_THERMAL
  212. tristate "Renesas R-Car Gen3 thermal driver"
  213. depends on ARCH_RENESAS || COMPILE_TEST
  214. depends on HAS_IOMEM
  215. depends on OF
  216. help
  217. Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
  218. thermal framework.
  219. config KIRKWOOD_THERMAL
  220. tristate "Temperature sensor on Marvell Kirkwood SoCs"
  221. depends on MACH_KIRKWOOD || COMPILE_TEST
  222. depends on HAS_IOMEM
  223. depends on OF
  224. help
  225. Support for the Kirkwood thermal sensor driver into the Linux thermal
  226. framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
  227. config DOVE_THERMAL
  228. tristate "Temperature sensor on Marvell Dove SoCs"
  229. depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
  230. depends on HAS_IOMEM
  231. depends on OF
  232. help
  233. Support for the Dove thermal sensor driver in the Linux thermal
  234. framework.
  235. config DB8500_THERMAL
  236. tristate "DB8500 thermal management"
  237. depends on MFD_DB8500_PRCMU
  238. default y
  239. help
  240. Adds DB8500 thermal management implementation according to the thermal
  241. management framework. A thermal zone with several trip points will be
  242. created. Cooling devices can be bound to the trip points to cool this
  243. thermal zone if trip points reached.
  244. config ARMADA_THERMAL
  245. tristate "Armada 370/XP thermal management"
  246. depends on ARCH_MVEBU || COMPILE_TEST
  247. depends on HAS_IOMEM
  248. depends on OF
  249. help
  250. Enable this option if you want to have support for thermal management
  251. controller present in Armada 370 and Armada XP SoC.
  252. config DB8500_CPUFREQ_COOLING
  253. tristate "DB8500 cpufreq cooling"
  254. depends on ARCH_U8500 || COMPILE_TEST
  255. depends on HAS_IOMEM
  256. depends on CPU_THERMAL
  257. default y
  258. help
  259. Adds DB8500 cpufreq cooling devices, and these cooling devices can be
  260. bound to thermal zone trip points. When a trip point reached, the
  261. bound cpufreq cooling device turns active to set CPU frequency low to
  262. cool down the CPU.
  263. config INTEL_POWERCLAMP
  264. tristate "Intel PowerClamp idle injection driver"
  265. depends on THERMAL
  266. depends on X86
  267. depends on CPU_SUP_INTEL
  268. help
  269. Enable this to enable Intel PowerClamp idle injection driver. This
  270. enforce idle time which results in more package C-state residency. The
  271. user interface is exposed via generic thermal framework.
  272. config X86_PKG_TEMP_THERMAL
  273. tristate "X86 package temperature thermal driver"
  274. depends on X86_THERMAL_VECTOR
  275. select THERMAL_GOV_USER_SPACE
  276. select THERMAL_WRITABLE_TRIPS
  277. default m
  278. help
  279. Enable this to register CPU digital sensor for package temperature as
  280. thermal zone. Each package will have its own thermal zone. There are
  281. two trip points which can be set by user to get notifications via thermal
  282. notification methods.
  283. config INTEL_SOC_DTS_IOSF_CORE
  284. tristate
  285. depends on X86
  286. select IOSF_MBI
  287. help
  288. This is becoming a common feature for Intel SoCs to expose the additional
  289. digital temperature sensors (DTSs) using side band interface (IOSF). This
  290. implements the common set of helper functions to register, get temperature
  291. and get/set thresholds on DTSs.
  292. config INTEL_SOC_DTS_THERMAL
  293. tristate "Intel SoCs DTS thermal driver"
  294. depends on X86
  295. select INTEL_SOC_DTS_IOSF_CORE
  296. select THERMAL_WRITABLE_TRIPS
  297. help
  298. Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
  299. temperature sensor (DTS). These SoCs have two additional DTSs in
  300. addition to DTSs on CPU cores. Each DTS will be registered as a
  301. thermal zone. There are two trip points. One of the trip point can
  302. be set by user mode programs to get notifications via Linux thermal
  303. notification methods.The other trip is a critical trip point, which
  304. was set by the driver based on the TJ MAX temperature.
  305. config INTEL_QUARK_DTS_THERMAL
  306. tristate "Intel Quark DTS thermal driver"
  307. depends on X86_INTEL_QUARK
  308. help
  309. Enable this to register Intel Quark SoC (e.g. X1000) platform digital
  310. temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
  311. The DTS will be registered as a thermal zone. There are two trip points:
  312. hot & critical. The critical trip point default value is set by
  313. underlying BIOS/Firmware.
  314. menu "ACPI INT340X thermal drivers"
  315. source drivers/thermal/int340x_thermal/Kconfig
  316. endmenu
  317. config INTEL_BXT_PMIC_THERMAL
  318. tristate "Intel Broxton PMIC thermal driver"
  319. depends on X86 && INTEL_SOC_PMIC && REGMAP
  320. help
  321. Select this driver for Intel Broxton PMIC with ADC channels monitoring
  322. system temperature measurements and alerts.
  323. This driver is used for monitoring the ADC channels of PMIC and handles
  324. the alert trip point interrupts and notifies the thermal framework with
  325. the trip point and temperature details of the zone.
  326. config INTEL_PCH_THERMAL
  327. tristate "Intel PCH Thermal Reporting Driver"
  328. depends on X86 && PCI
  329. help
  330. Enable this to support thermal reporting on certain intel PCHs.
  331. Thermal reporting device will provide temperature reading,
  332. programmable trip points and other information.
  333. config MTK_THERMAL
  334. tristate "Temperature sensor driver for mediatek SoCs"
  335. depends on ARCH_MEDIATEK || COMPILE_TEST
  336. depends on HAS_IOMEM
  337. depends on NVMEM || NVMEM=n
  338. depends on RESET_CONTROLLER
  339. default y
  340. help
  341. Enable this option if you want to have support for thermal management
  342. controller present in Mediatek SoCs
  343. menu "Texas Instruments thermal drivers"
  344. depends on ARCH_HAS_BANDGAP || COMPILE_TEST
  345. depends on HAS_IOMEM
  346. source "drivers/thermal/ti-soc-thermal/Kconfig"
  347. endmenu
  348. menu "Samsung thermal drivers"
  349. depends on ARCH_EXYNOS || COMPILE_TEST
  350. source "drivers/thermal/samsung/Kconfig"
  351. endmenu
  352. menu "STMicroelectronics thermal drivers"
  353. depends on ARCH_STI && OF
  354. source "drivers/thermal/st/Kconfig"
  355. endmenu
  356. config TANGO_THERMAL
  357. tristate "Tango thermal management"
  358. depends on ARCH_TANGO || COMPILE_TEST
  359. help
  360. Enable the Tango thermal driver, which supports the primitive
  361. temperature sensor embedded in Tango chips since the SMP8758.
  362. This sensor only generates a 1-bit signal to indicate whether
  363. the die temperature exceeds a programmable threshold.
  364. source "drivers/thermal/tegra/Kconfig"
  365. config QCOM_SPMI_TEMP_ALARM
  366. tristate "Qualcomm SPMI PMIC Temperature Alarm"
  367. depends on OF && SPMI && IIO
  368. select REGMAP_SPMI
  369. help
  370. This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
  371. PMIC devices. It shows up in sysfs as a thermal sensor with multiple
  372. trip points. The temperature reported by the thermal sensor reflects the
  373. real time die temperature if an ADC is present or an estimate of the
  374. temperature based upon the over temperature stage value.
  375. config GENERIC_ADC_THERMAL
  376. tristate "Generic ADC based thermal sensor"
  377. depends on IIO
  378. help
  379. This enabled a thermal sysfs driver for the temperature sensor
  380. which is connected to the General Purpose ADC. The ADC channel
  381. is read via IIO framework and the channel information is provided
  382. to this driver. This driver reports the temperature by reading ADC
  383. channel and converts it to temperature based on lookup table.
  384. menu "Qualcomm thermal drivers"
  385. depends on (ARCH_QCOM && OF) || COMPILE_TEST
  386. source "drivers/thermal/qcom/Kconfig"
  387. endmenu
  388. config ZX2967_THERMAL
  389. tristate "Thermal sensors on zx2967 SoC"
  390. depends on ARCH_ZX || COMPILE_TEST
  391. help
  392. Enable the zx2967 thermal sensors driver, which supports
  393. the primitive temperature sensor embedded in zx2967 SoCs.
  394. This sensor generates the real time die temperature.
  395. endif