Kconfig 16 KB

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  1. #
  2. # Generic thermal sysfs drivers configuration
  3. #
  4. menuconfig THERMAL
  5. tristate "Generic Thermal sysfs driver"
  6. help
  7. Generic Thermal Sysfs driver offers a generic mechanism for
  8. thermal management. Usually it's made up of one or more thermal
  9. zone and cooling device.
  10. Each thermal zone contains its own temperature, trip points,
  11. cooling devices.
  12. All platforms with ACPI thermal support can use this driver.
  13. If you want this support, you should say Y or M here.
  14. if THERMAL
  15. config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
  16. int "Emergency poweroff delay in milli-seconds"
  17. depends on THERMAL
  18. default 0
  19. help
  20. Thermal subsystem will issue a graceful shutdown when
  21. critical temperatures are reached using orderly_poweroff(). In
  22. case of failure of an orderly_poweroff(), the thermal emergency
  23. poweroff kicks in after a delay has elapsed and shuts down the system.
  24. This config is number of milliseconds to delay before emergency
  25. poweroff kicks in. Similarly to the critical trip point,
  26. the delay should be carefully profiled so as to give adequate
  27. time for orderly_poweroff() to finish on regular execution.
  28. If set to 0 emergency poweroff will not be supported.
  29. In doubt, leave as 0.
  30. config THERMAL_HWMON
  31. bool
  32. prompt "Expose thermal sensors as hwmon device"
  33. depends on HWMON=y || HWMON=THERMAL
  34. default y
  35. help
  36. In case a sensor is registered with the thermal
  37. framework, this option will also register it
  38. as a hwmon. The sensor will then have the common
  39. hwmon sysfs interface.
  40. Say 'Y' here if you want all thermal sensors to
  41. have hwmon sysfs interface too.
  42. config THERMAL_OF
  43. bool
  44. prompt "APIs to parse thermal data out of device tree"
  45. depends on OF
  46. default y
  47. help
  48. This options provides helpers to add the support to
  49. read and parse thermal data definitions out of the
  50. device tree blob.
  51. Say 'Y' here if you need to build thermal infrastructure
  52. based on device tree.
  53. config THERMAL_WRITABLE_TRIPS
  54. bool "Enable writable trip points"
  55. help
  56. This option allows the system integrator to choose whether
  57. trip temperatures can be changed from userspace. The
  58. writable trips need to be specified when setting up the
  59. thermal zone but the choice here takes precedence.
  60. Say 'Y' here if you would like to allow userspace tools to
  61. change trip temperatures.
  62. choice
  63. prompt "Default Thermal governor"
  64. default THERMAL_DEFAULT_GOV_STEP_WISE
  65. help
  66. This option sets which thermal governor shall be loaded at
  67. startup. If in doubt, select 'step_wise'.
  68. config THERMAL_DEFAULT_GOV_STEP_WISE
  69. bool "step_wise"
  70. select THERMAL_GOV_STEP_WISE
  71. help
  72. Use the step_wise governor as default. This throttles the
  73. devices one step at a time.
  74. config THERMAL_DEFAULT_GOV_FAIR_SHARE
  75. bool "fair_share"
  76. select THERMAL_GOV_FAIR_SHARE
  77. help
  78. Use the fair_share governor as default. This throttles the
  79. devices based on their 'contribution' to a zone. The
  80. contribution should be provided through platform data.
  81. config THERMAL_DEFAULT_GOV_USER_SPACE
  82. bool "user_space"
  83. select THERMAL_GOV_USER_SPACE
  84. help
  85. Select this if you want to let the user space manage the
  86. platform thermals.
  87. config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  88. bool "power_allocator"
  89. select THERMAL_GOV_POWER_ALLOCATOR
  90. help
  91. Select this if you want to control temperature based on
  92. system and device power allocation. This governor can only
  93. operate on cooling devices that implement the power API.
  94. endchoice
  95. config THERMAL_GOV_FAIR_SHARE
  96. bool "Fair-share thermal governor"
  97. help
  98. Enable this to manage platform thermals using fair-share governor.
  99. config THERMAL_GOV_STEP_WISE
  100. bool "Step_wise thermal governor"
  101. help
  102. Enable this to manage platform thermals using a simple linear
  103. governor.
  104. config THERMAL_GOV_BANG_BANG
  105. bool "Bang Bang thermal governor"
  106. default n
  107. help
  108. Enable this to manage platform thermals using bang bang governor.
  109. Say 'Y' here if you want to use two point temperature regulation
  110. used for fans without throttling. Some fan drivers depend on this
  111. governor to be enabled (e.g. acerhdf).
  112. config THERMAL_GOV_USER_SPACE
  113. bool "User_space thermal governor"
  114. help
  115. Enable this to let the user space manage the platform thermals.
  116. config THERMAL_GOV_POWER_ALLOCATOR
  117. bool "Power allocator thermal governor"
  118. help
  119. Enable this to manage platform thermals by dynamically
  120. allocating and limiting power to devices.
  121. config CPU_THERMAL
  122. bool "generic cpu cooling support"
  123. depends on CPU_FREQ
  124. depends on THERMAL_OF
  125. help
  126. This implements the generic cpu cooling mechanism through frequency
  127. reduction. An ACPI version of this already exists
  128. (drivers/acpi/processor_thermal.c).
  129. This will be useful for platforms using the generic thermal interface
  130. and not the ACPI interface.
  131. If you want this support, you should say Y here.
  132. config CLOCK_THERMAL
  133. bool "Generic clock cooling support"
  134. depends on COMMON_CLK
  135. depends on PM_OPP
  136. help
  137. This entry implements the generic clock cooling mechanism through
  138. frequency clipping. Typically used to cool off co-processors. The
  139. device that is configured to use this cooling mechanism will be
  140. controlled to reduce clock frequency whenever temperature is high.
  141. config DEVFREQ_THERMAL
  142. bool "Generic device cooling support"
  143. depends on PM_DEVFREQ
  144. depends on PM_OPP
  145. help
  146. This implements the generic devfreq cooling mechanism through
  147. frequency reduction for devices using devfreq.
  148. This will throttle the device by limiting the maximum allowed DVFS
  149. frequency corresponding to the cooling level.
  150. In order to use the power extensions of the cooling device,
  151. devfreq should use the simple_ondemand governor.
  152. If you want this support, you should say Y here.
  153. config THERMAL_EMULATION
  154. bool "Thermal emulation mode support"
  155. help
  156. Enable this option to make a emul_temp sysfs node in thermal zone
  157. directory to support temperature emulation. With emulation sysfs node,
  158. user can manually input temperature and test the different trip
  159. threshold behaviour for simulation purpose.
  160. WARNING: Be careful while enabling this option on production systems,
  161. because userland can easily disable the thermal policy by simply
  162. flooding this sysfs node with low temperature values.
  163. config HISI_THERMAL
  164. tristate "Hisilicon thermal driver"
  165. depends on ARCH_HISI || COMPILE_TEST
  166. depends on HAS_IOMEM
  167. depends on OF
  168. default y
  169. help
  170. Enable this to plug hisilicon's thermal sensor driver into the Linux
  171. thermal framework. cpufreq is used as the cooling device to throttle
  172. CPUs when the passive trip is crossed.
  173. config IMX_THERMAL
  174. tristate "Temperature sensor driver for Freescale i.MX SoCs"
  175. depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
  176. depends on MFD_SYSCON
  177. depends on OF
  178. help
  179. Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
  180. It supports one critical trip point and one passive trip point. The
  181. cpufreq is used as the cooling device to throttle CPUs when the
  182. passive trip is crossed.
  183. config MAX77620_THERMAL
  184. tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
  185. depends on MFD_MAX77620
  186. depends on OF
  187. help
  188. Support for die junction temperature warning alarm for Maxim
  189. Semiconductor PMIC MAX77620 device. Device generates two alarm
  190. interrupts when PMIC die temperature cross the threshold of
  191. 120 degC and 140 degC.
  192. config QORIQ_THERMAL
  193. tristate "QorIQ Thermal Monitoring Unit"
  194. depends on THERMAL_OF
  195. depends on HAS_IOMEM
  196. help
  197. Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
  198. It supports one critical trip point and one passive trip point. The
  199. cpufreq is used as the cooling device to throttle CPUs when the
  200. passive trip is crossed.
  201. config SPEAR_THERMAL
  202. tristate "SPEAr thermal sensor driver"
  203. depends on PLAT_SPEAR || COMPILE_TEST
  204. depends on HAS_IOMEM
  205. depends on OF
  206. help
  207. Enable this to plug the SPEAr thermal sensor driver into the Linux
  208. thermal framework.
  209. config ROCKCHIP_THERMAL
  210. tristate "Rockchip thermal driver"
  211. depends on ARCH_ROCKCHIP || COMPILE_TEST
  212. depends on RESET_CONTROLLER
  213. depends on HAS_IOMEM
  214. help
  215. Rockchip thermal driver provides support for Temperature sensor
  216. ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
  217. trip point. Cpufreq is used as the cooling device and will throttle
  218. CPUs when the Temperature crosses the passive trip point.
  219. config RCAR_THERMAL
  220. tristate "Renesas R-Car thermal driver"
  221. depends on ARCH_RENESAS || COMPILE_TEST
  222. depends on HAS_IOMEM
  223. help
  224. Enable this to plug the R-Car thermal sensor driver into the Linux
  225. thermal framework.
  226. config RCAR_GEN3_THERMAL
  227. tristate "Renesas R-Car Gen3 thermal driver"
  228. depends on ARCH_RENESAS || COMPILE_TEST
  229. depends on HAS_IOMEM
  230. depends on OF
  231. help
  232. Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
  233. thermal framework.
  234. config KIRKWOOD_THERMAL
  235. tristate "Temperature sensor on Marvell Kirkwood SoCs"
  236. depends on MACH_KIRKWOOD || COMPILE_TEST
  237. depends on HAS_IOMEM
  238. depends on OF
  239. help
  240. Support for the Kirkwood thermal sensor driver into the Linux thermal
  241. framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
  242. config DOVE_THERMAL
  243. tristate "Temperature sensor on Marvell Dove SoCs"
  244. depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
  245. depends on HAS_IOMEM
  246. depends on OF
  247. help
  248. Support for the Dove thermal sensor driver in the Linux thermal
  249. framework.
  250. config DB8500_THERMAL
  251. tristate "DB8500 thermal management"
  252. depends on MFD_DB8500_PRCMU
  253. default y
  254. help
  255. Adds DB8500 thermal management implementation according to the thermal
  256. management framework. A thermal zone with several trip points will be
  257. created. Cooling devices can be bound to the trip points to cool this
  258. thermal zone if trip points reached.
  259. config ARMADA_THERMAL
  260. tristate "Armada 370/XP thermal management"
  261. depends on ARCH_MVEBU || COMPILE_TEST
  262. depends on HAS_IOMEM
  263. depends on OF
  264. help
  265. Enable this option if you want to have support for thermal management
  266. controller present in Armada 370 and Armada XP SoC.
  267. config DA9062_THERMAL
  268. tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
  269. depends on MFD_DA9062 || COMPILE_TEST
  270. depends on OF
  271. help
  272. Enable this for the Dialog Semiconductor thermal sensor driver.
  273. This will report PMIC junction over-temperature for one thermal trip
  274. zone.
  275. Compatible with the DA9062 and DA9061 PMICs.
  276. config INTEL_POWERCLAMP
  277. tristate "Intel PowerClamp idle injection driver"
  278. depends on THERMAL
  279. depends on X86
  280. depends on CPU_SUP_INTEL
  281. help
  282. Enable this to enable Intel PowerClamp idle injection driver. This
  283. enforce idle time which results in more package C-state residency. The
  284. user interface is exposed via generic thermal framework.
  285. config X86_PKG_TEMP_THERMAL
  286. tristate "X86 package temperature thermal driver"
  287. depends on X86_THERMAL_VECTOR
  288. select THERMAL_GOV_USER_SPACE
  289. select THERMAL_WRITABLE_TRIPS
  290. default m
  291. help
  292. Enable this to register CPU digital sensor for package temperature as
  293. thermal zone. Each package will have its own thermal zone. There are
  294. two trip points which can be set by user to get notifications via thermal
  295. notification methods.
  296. config INTEL_SOC_DTS_IOSF_CORE
  297. tristate
  298. depends on X86
  299. select IOSF_MBI
  300. help
  301. This is becoming a common feature for Intel SoCs to expose the additional
  302. digital temperature sensors (DTSs) using side band interface (IOSF). This
  303. implements the common set of helper functions to register, get temperature
  304. and get/set thresholds on DTSs.
  305. config INTEL_SOC_DTS_THERMAL
  306. tristate "Intel SoCs DTS thermal driver"
  307. depends on X86
  308. select INTEL_SOC_DTS_IOSF_CORE
  309. select THERMAL_WRITABLE_TRIPS
  310. help
  311. Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
  312. temperature sensor (DTS). These SoCs have two additional DTSs in
  313. addition to DTSs on CPU cores. Each DTS will be registered as a
  314. thermal zone. There are two trip points. One of the trip point can
  315. be set by user mode programs to get notifications via Linux thermal
  316. notification methods.The other trip is a critical trip point, which
  317. was set by the driver based on the TJ MAX temperature.
  318. config INTEL_QUARK_DTS_THERMAL
  319. tristate "Intel Quark DTS thermal driver"
  320. depends on X86_INTEL_QUARK
  321. help
  322. Enable this to register Intel Quark SoC (e.g. X1000) platform digital
  323. temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
  324. The DTS will be registered as a thermal zone. There are two trip points:
  325. hot & critical. The critical trip point default value is set by
  326. underlying BIOS/Firmware.
  327. menu "ACPI INT340X thermal drivers"
  328. source drivers/thermal/int340x_thermal/Kconfig
  329. endmenu
  330. config INTEL_BXT_PMIC_THERMAL
  331. tristate "Intel Broxton PMIC thermal driver"
  332. depends on X86 && INTEL_SOC_PMIC_BXTWC && REGMAP
  333. help
  334. Select this driver for Intel Broxton PMIC with ADC channels monitoring
  335. system temperature measurements and alerts.
  336. This driver is used for monitoring the ADC channels of PMIC and handles
  337. the alert trip point interrupts and notifies the thermal framework with
  338. the trip point and temperature details of the zone.
  339. config INTEL_PCH_THERMAL
  340. tristate "Intel PCH Thermal Reporting Driver"
  341. depends on X86 && PCI
  342. help
  343. Enable this to support thermal reporting on certain intel PCHs.
  344. Thermal reporting device will provide temperature reading,
  345. programmable trip points and other information.
  346. config MTK_THERMAL
  347. tristate "Temperature sensor driver for mediatek SoCs"
  348. depends on ARCH_MEDIATEK || COMPILE_TEST
  349. depends on HAS_IOMEM
  350. depends on NVMEM || NVMEM=n
  351. depends on RESET_CONTROLLER
  352. default y
  353. help
  354. Enable this option if you want to have support for thermal management
  355. controller present in Mediatek SoCs
  356. menu "Broadcom thermal drivers"
  357. depends on ARCH_BCM || COMPILE_TEST
  358. source "drivers/thermal/broadcom/Kconfig"
  359. endmenu
  360. menu "Texas Instruments thermal drivers"
  361. depends on ARCH_HAS_BANDGAP || COMPILE_TEST
  362. depends on HAS_IOMEM
  363. source "drivers/thermal/ti-soc-thermal/Kconfig"
  364. endmenu
  365. menu "Samsung thermal drivers"
  366. depends on ARCH_EXYNOS || COMPILE_TEST
  367. source "drivers/thermal/samsung/Kconfig"
  368. endmenu
  369. menu "STMicroelectronics thermal drivers"
  370. depends on ARCH_STI && OF
  371. source "drivers/thermal/st/Kconfig"
  372. endmenu
  373. config TANGO_THERMAL
  374. tristate "Tango thermal management"
  375. depends on ARCH_TANGO || COMPILE_TEST
  376. help
  377. Enable the Tango thermal driver, which supports the primitive
  378. temperature sensor embedded in Tango chips since the SMP8758.
  379. This sensor only generates a 1-bit signal to indicate whether
  380. the die temperature exceeds a programmable threshold.
  381. source "drivers/thermal/tegra/Kconfig"
  382. config QCOM_SPMI_TEMP_ALARM
  383. tristate "Qualcomm SPMI PMIC Temperature Alarm"
  384. depends on OF && SPMI && IIO
  385. select REGMAP_SPMI
  386. help
  387. This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
  388. PMIC devices. It shows up in sysfs as a thermal sensor with multiple
  389. trip points. The temperature reported by the thermal sensor reflects the
  390. real time die temperature if an ADC is present or an estimate of the
  391. temperature based upon the over temperature stage value.
  392. config GENERIC_ADC_THERMAL
  393. tristate "Generic ADC based thermal sensor"
  394. depends on IIO
  395. help
  396. This enabled a thermal sysfs driver for the temperature sensor
  397. which is connected to the General Purpose ADC. The ADC channel
  398. is read via IIO framework and the channel information is provided
  399. to this driver. This driver reports the temperature by reading ADC
  400. channel and converts it to temperature based on lookup table.
  401. menu "Qualcomm thermal drivers"
  402. depends on (ARCH_QCOM && OF) || COMPILE_TEST
  403. source "drivers/thermal/qcom/Kconfig"
  404. endmenu
  405. config ZX2967_THERMAL
  406. tristate "Thermal sensors on zx2967 SoC"
  407. depends on ARCH_ZX || COMPILE_TEST
  408. help
  409. Enable the zx2967 thermal sensors driver, which supports
  410. the primitive temperature sensor embedded in zx2967 SoCs.
  411. This sensor generates the real time die temperature.
  412. endif