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@@ -194,6 +194,8 @@ thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
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/sys/class/thermal/thermal_zone[0-*]:
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/sys/class/thermal/thermal_zone[0-*]:
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|---cdev[0-*]: [0-*]th cooling device in current thermal zone
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|---cdev[0-*]: [0-*]th cooling device in current thermal zone
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|---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
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|---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with
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+ |---cdev[0-*]_weight: Influence of the cooling device in
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+ this thermal zone
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Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
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Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
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the generic thermal driver also creates a hwmon sysfs I/F for each _type_
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the generic thermal driver also creates a hwmon sysfs I/F for each _type_
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@@ -267,6 +269,14 @@ cdev[0-*]_trip_point
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point.
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point.
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RO, Optional
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RO, Optional
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+cdev[0-*]_weight
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+ The influence of cdev[0-*] in this thermal zone. This value
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+ is relative to the rest of cooling devices in the thermal
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+ zone. For example, if a cooling device has a weight double
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+ than that of other, it's twice as effective in cooling the
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+ thermal zone.
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+ RW, Optional
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+
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passive
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passive
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Attribute is only present for zones in which the passive cooling
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Attribute is only present for zones in which the passive cooling
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policy is not supported by native thermal driver. Default is zero
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policy is not supported by native thermal driver. Default is zero
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@@ -320,7 +330,8 @@ passive, active. If an ACPI thermal zone supports critical, passive,
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active[0] and active[1] at the same time, it may register itself as a
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active[0] and active[1] at the same time, it may register itself as a
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thermal_zone_device (thermal_zone1) with 4 trip points in all.
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thermal_zone_device (thermal_zone1) with 4 trip points in all.
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It has one processor and one fan, which are both registered as
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It has one processor and one fan, which are both registered as
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-thermal_cooling_device.
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+thermal_cooling_device. Both are considered to have the same
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+effectiveness in cooling the thermal zone.
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If the processor is listed in _PSL method, and the fan is listed in _AL0
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If the processor is listed in _PSL method, and the fan is listed in _AL0
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method, the sys I/F structure will be built like this:
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method, the sys I/F structure will be built like this:
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@@ -342,8 +353,10 @@ method, the sys I/F structure will be built like this:
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|---trip_point_3_type: active1
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|---trip_point_3_type: active1
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|---cdev0: --->/sys/class/thermal/cooling_device0
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|---cdev0: --->/sys/class/thermal/cooling_device0
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|---cdev0_trip_point: 1 /* cdev0 can be used for passive */
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|---cdev0_trip_point: 1 /* cdev0 can be used for passive */
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+ |---cdev0_weight: 1024
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|---cdev1: --->/sys/class/thermal/cooling_device3
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|---cdev1: --->/sys/class/thermal/cooling_device3
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|---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
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|---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/
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+ |---cdev1_weight: 1024
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|cooling_device0:
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|cooling_device0:
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|---type: Processor
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|---type: Processor
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