ixgbe: Add support for newer thermal alarm

The newer copper PHY implementation used with newer X550EM_x
devices uses a different thermal alarm type than the earlier
one. Make changes to support both types.

Signed-off-by: Mark Rustad <mark.d.rustad@intel.com>
Tested-by: Darin Miller <darin.j.miller@intel.com>
Signed-off-by: Jeff Kirsher <jeffrey.t.kirsher@intel.com>

drivers/net/ethernet/intel/ixgbe/ixgbe_type.h

@@ -1345,7 +1345,10 @@ struct ixgbe_thermal_sensor_data {
 #define IXGBE_MDIO_GLOBAL_INT_CHIP_VEN_MASK	0xFF01 /* int chip-wide mask */
 #define IXGBE_MDIO_GLOBAL_INT_CHIP_VEN_FLAG	0xFC01 /* int chip-wide mask */
 #define IXGBE_MDIO_GLOBAL_ALARM_1		0xCC00 /* Global alarm 1 */
+#define IXGBE_MDIO_GLOBAL_ALM_1_DEV_FAULT	0x0010 /* device fault */
 #define IXGBE_MDIO_GLOBAL_ALM_1_HI_TMP_FAIL	0x4000 /* high temp failure */
+#define IXGBE_MDIO_GLOBAL_FAULT_MSG		0xC850 /* global fault msg */
+#define IXGBE_MDIO_GLOBAL_FAULT_MSG_HI_TMP	0x8007 /* high temp failure */
 #define IXGBE_MDIO_GLOBAL_INT_MASK		0xD400 /* Global int mask */
 /* autoneg vendor alarm int enable */
 #define IXGBE_MDIO_GLOBAL_AN_VEN_ALM_INT_EN	0x1000
@@ -1353,6 +1356,7 @@ struct ixgbe_thermal_sensor_data {
 #define IXGBE_MDIO_GLOBAL_VEN_ALM_INT_EN	0x1 /* vendor alarm int enable */
 #define IXGBE_MDIO_GLOBAL_STD_ALM2_INT		0x200 /* vendor alarm2 int mask */
 #define IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN	0x4000 /* int high temp enable */
+#define IXGBE_MDIO_GLOBAL_INT_DEV_FAULT_EN	0x0010 /*int dev fault enable */
 
 #define IXGBE_MDIO_PMA_PMD_SDA_SCL_ADDR	0xC30A /* PHY_XS SDA/SCL Addr Reg */
 #define IXGBE_MDIO_PMA_PMD_SDA_SCL_DATA	0xC30B /* PHY_XS SDA/SCL Data Reg */

drivers/net/ethernet/intel/ixgbe/ixgbe_x550.c

@@ -1444,7 +1444,7 @@ static s32 ixgbe_get_lasi_ext_t_x550em(struct ixgbe_hw *hw, bool *lsc)
 				IXGBE_MDIO_GLOBAL_ALARM_1_INT)))
 		return status;
 
-	/* High temperature failure alarm triggered */
+	/* Global alarm triggered */
 	status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_ALARM_1,
 				      IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,
 				      &reg);
@@ -1458,6 +1458,21 @@ static s32 ixgbe_get_lasi_ext_t_x550em(struct ixgbe_hw *hw, bool *lsc)
 		ixgbe_set_copper_phy_power(hw, false);
 		return IXGBE_ERR_OVERTEMP;
 	}
+	if (reg & IXGBE_MDIO_GLOBAL_ALM_1_DEV_FAULT) {
+		/*  device fault alarm triggered */
+		status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_FAULT_MSG,
+					  IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,
+					  &reg);
+		if (status)
+			return status;
+
+		/* if device fault was due to high temp alarm handle and exit */
+		if (reg == IXGBE_MDIO_GLOBAL_FAULT_MSG_HI_TMP) {
+			/* power down the PHY in case the PHY FW didn't */
+			ixgbe_set_copper_phy_power(hw, false);
+			return IXGBE_ERR_OVERTEMP;
+		}
+	}
 
 	/* Vendor alarm 2 triggered */
 	status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_CHIP_STD_INT_FLAG,
@@ -1511,14 +1526,15 @@ static s32 ixgbe_enable_lasi_ext_t_x550em(struct ixgbe_hw *hw)
 	if (status)
 		return status;
 
-	/* Enables high temperature failure alarm */
+	/* Enable high temperature failure and global fault alarms */
 	status = hw->phy.ops.read_reg(hw, IXGBE_MDIO_GLOBAL_INT_MASK,
 				      IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,
 				      &reg);
 	if (status)
 		return status;
 
-	reg |= IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN;
+	reg |= (IXGBE_MDIO_GLOBAL_INT_HI_TEMP_EN |
+		IXGBE_MDIO_GLOBAL_INT_DEV_FAULT_EN);
 
 	status = hw->phy.ops.write_reg(hw, IXGBE_MDIO_GLOBAL_INT_MASK,
 				       IXGBE_MDIO_VENDOR_SPECIFIC_1_DEV_TYPE,